Semi-conductor R&D / /
Semiconductor
亞洲全區
Face-to-face negotiation
Qualifications
Advance Package Testing
Job Advantage
先進封裝相關職位
Responsibilities
1. 3D Package device Development PA
2. Heterogeneous Integration PA
3. Panel Level Integration
4. Thermal Simulation, Electrical Simulation, Mechanical Simulation
5. PCB Design, RDL and Interposer Design, Advanced ackage Design
6. RDL Process Development
7. PKG Process Development
8. Advanced PKG material Development
9. Advanced PKG material analysis
10. Advanced PKG PCB Development
11. Advanced PKG Manual Element Development
12. Customer Service
2. Heterogeneous Integration PA
3. Panel Level Integration
4. Thermal Simulation, Electrical Simulation, Mechanical Simulation
5. PCB Design, RDL and Interposer Design, Advanced ackage Design
6. RDL Process Development
7. PKG Process Development
8. Advanced PKG material Development
9. Advanced PKG material analysis
10. Advanced PKG PCB Development
11. Advanced PKG Manual Element Development
12. Customer Service
Ideal Candidate
6~10年先進封裝相關經驗
Other Requirements
Education:Undergraduate
Department: , ,
Experience:Over 6 years of experience
Management Responsibilities:To be determined
Business trip:Need business trip/overseas assignment, but the number of trips accumulated within a year is unknown
Department: , ,
Experience:Over 6 years of experience
Language:
English：Listening/Fluent Speaking/Fluent Reading/Fluent Writing/Fluent
Business trip:Need business trip/overseas assignment, but the number of trips accumulated within a year is unknown
Employee Benefits
Required by law:勞保 健保 陪產假 產假 特別休假 育嬰留停 女性生理假 勞退提撥金 產檢假 就業保險 職災保險
