硬體設計主管

Hardware Engineering R&D Manager
Switching Equipments
桃園市全區
Face-to-face negotiation
General Company | Mid-level 2024/03/25

硬體設計主管

Hardware Engineering R&D Manager
Switching Equipments
桃園市全區
Face-to-face negotiation

Qualifications

熟悉網通系統板設計能力熟悉pcba主板設計能力

Job Advantage

集團企業
福利佳

Responsibilities

1.熟悉硬體MCU或主機板PCBA研發設計
2.具備數位機上盒或系統主板規劃設計能力
3.熟悉硬體ODM/OEM溝通協調設計專案能力

Ideal Candidate

1.工控主板系統主板PCBA能力
2.能跟客戶討論主板硬體規劃能力
3.熟悉網通或電腦系統硬體設計經驗尤佳

Other Requirements

Education:Specialist
Department:Electrical engineering,Communication & telecommunication
Experience:Over 5 years of experience
Language:
English:Listening/Intermediate Speaking/Intermediate Reading/Intermediate Writing/Intermediate
Management Responsibilities:Not need to bear any management responsibilities
Business trip:No business trip required

Employee Benefits

Required by law:勞保 健保 陪產假 產假 特別休假 育嬰留停 女性生理假 勞退提撥金 產檢假 就業保險 職災保險

Case Number:FA01010030

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