Responsibilities
To develop advance packaging platform with miniaturize, and high integration
To development new power module product with high power density, and high efficiency
NPD/QFD/DOE procedure
Customers developing with sales
Ideal Candidate
Master or PhD degree in engineering such as chemical, material, mechanical…. etc
More than 8 years working experience in PCB, packaging, or component industry
Strong technical fundament knowledge in material and process
Experience in IMC or other metallic interfacial research in the packaging industry
Proven track record in engineering innovation, e.g. research publications and patents
Extensive knowledge in the advance packaging industry preferred