研發處_製程開發工程師/高級工程師

• Develop 3-5 years technology roadmap aligned with the company business need, market trend and technology advancement.
• Develop best in class technology to compete with tier 1 competitors to showcase capability and win new business. Application is focus on but not limited to high power switching power supplies for data center application such as power shelves, and power racks.
• Investigate and implement latest materials and technology on magnetics core, geometry, winding technique, assembly structure to achieve best in class efficiency and size.
• Investigate and implementation of latest devices, design architecture and topology, firmware control & algorithm to achieve best in class performance
• Perform calculation and simulation of schematic design, magnetics design and thermal management
• Development of fully working prototypes for internal and external demonstration. Prototypes (reference design) with quality and maturity level that can be handed to product desig

1、規劃設計三相BLDC/PMSM⾺達驅動器：
■ 功率級(MOSFET、Gate Driver、電流量測)
■ 控制級(MCU、感測器、保護迴路)
■ 電源級(Buck/Flyback輔助電源)。
2、設計保護機制：
OCP、OVP、UVLO、OTP、短路、反接、堵轉偵測、浪湧與突入電流抑制。
3、PCB電路與佈局：
電⼒與訊號區隔、散熱與堆疊規劃、DFM與可測試性(DFT)佈點。

1.依客戶的水冷散熱器產品設計提供可行性評估
2.依客戶的邊界條件進行產品設計與熱性能模擬(ODM案)
3.將客戶產品圖面(2D、3D)轉繪為公司內部半成品零件與成品組
立圖(OEM 案)
4.依照 APQP 流程需求製作開發階段需要的產品文件(如圖面、
BOM、樣品計劃書等等…)
5.依客戶產品需求進行包材設計
6. 開 發 階 段 產 品 之 規 格 問題 /潛 在風 險的統整與反饋
(Feasibility report & Design For Manufacturing)

1. FPGA implementation.
2. Integration of related FPGA (high-speed) interfaces.
3. System integration and verification.
4. FPGA Design, C/C++.
5. System simulation.

影像演算法、數位RTL Coding

1. AOI programming, system design and integration
2. Software writing (C, C++, Visual C++, MFC)
3. Requires knowledge related to imaging (image processing, image sensor, image quality, tuning, calibration, camera modules)
4. Software interface program modification.
5. Machine vision software design

1.電池設計、圖面產出
2.客戶需求確認及尺寸達標、製程可行性評估
3.工廠製程溝通協調
4.產品問題分析及改善方向討論

1.          In charge of Frond-End RF IC design, Analog RF IC design, Digital IC design teams
2.          Report to CEO
3.          Location in Taiwan