研發主管

1.依公司發展策略，擬定電子零組件產品之短.中.長期之研發計畫。
2.領導並監督研發團隊完成新產品開發及現有產品精進任務。
3.帶領並管理研發團隊，執行開發及進度督導規劃、人力協調與進度掌控。
4.跨部門溝通及協調。

1. FPGA implementation.
2. Integration of related FPGA (high-speed) interfaces.
3. System integration and verification.
4. FPGA Design, C/C++.
5. System simulation.

影像演算法、數位RTL Coding

1.具備生產、品保管理相關經驗
2.負責協助單位主管有關廠運營與品質作業
3.跨門溝通協調

高速 Serdes TX/RX 設計
1) 低抖動鎖相環設計(>5GHz)
2) TX 設計 (>5GHz)
3）RX設計（>5GHz）

1. 微型鏡頭光學設計(Compact Camera Module)
2. 雜散光模擬分析
3. 良率改善

1.EDA TOOL 客戶端支持服務
2.客戶bug解決
2.必要時支援on-site support
3.需熟悉Verilog及IC Flow
4.具獨立處理問題能力。

1. Establishment of new processes: Establish new equipment and new materials required for copper surface treatment and Metal Finishing processes, evaluate and introduce them (including establishment, implementation, inspection and improvement), and establish stable, capable and competitive processes.
2. New product introduction: Responsible for the development of technologies related to copper surface treatment and Metal Finishing processes required for NP and NPI-1 products, as well as the production output of related samples.
3. Lead important VE and process optimization: For the important VE of copper surface treatment and Metal Finishing process of NPI3 products, we can integrate and provide solutions and related Xn, and transfer them to engineering units and on-site units.
4. Trouble shooting: Assist in providing solutions to major quality anomalies related to copper surface treatment and Metal Finishing processes in each PCB factory.
5. Customer complaint handling: As