General Company | Mid-level
Advanced Engineering Director/Leader
硬體工程研發主管/硬體研發工程師｜ 消費性電子產品製造業 ｜新北市 ｜Salary negotiable (Regular monthly salary of NT$40,000 or above)
日期：2026/02/02 編號：F000013731
⭐️ Job Advantage
電腦及電腦週邊設備之設計研發 -- (企業級伺服器及儲存設備)
電源供應產品 (儲能相關) 及電動車充電設備之研發設計
Qualifications
硬體工程技術開發
Responsibilities
• Develop 3-5 years technology roadmap aligned with the company business need, market trend and technology advancement.
• Develop best in class technology to compete with tier 1 competitors to showcase capability and win new business. Application is focus on but not limited to high power switching power supplies for data center application such as power shelves, and power racks.
• Investigate and implement latest materials and technology on magnetics core, geometry, winding technique, assembly structure to achieve best in class efficiency and size.
• Investigate and implementation of latest devices, design architecture and topology, firmware control & algorithm to achieve best in class performance
• Perform calculation and simulation of schematic design, magnetics design and thermal management
• Development of fully working prototypes for internal and external demonstration. Prototypes (reference design) with quality and maturity level that can be handed to product desig
• Develop best in class technology to compete with tier 1 competitors to showcase capability and win new business. Application is focus on but not limited to high power switching power supplies for data center application such as power shelves, and power racks.
• Investigate and implement latest materials and technology on magnetics core, geometry, winding technique, assembly structure to achieve best in class efficiency and size.
• Investigate and implementation of latest devices, design architecture and topology, firmware control & algorithm to achieve best in class performance
• Perform calculation and simulation of schematic design, magnetics design and thermal management
• Development of fully working prototypes for internal and external demonstration. Prototypes (reference design) with quality and maturity level that can be handed to product desig
Ideal Candidate
• More than 15 years experience in power electronics with background on high power in server and data center application. Experience in BBU, energy storage and rack power is a plus.
• Experience in managing a team of engineers and technician with hands on attitude
• Good communication both in oral, writing and presentation in English
• Good interpersonal skill, able to deal with multi cultural and level of people
• Bachelor degree in electrical engineering. Master's degree, PhD is a plus.
• Self driven, team player and competitive attitude to be industry best in class.
• Experience in managing a team of engineers and technician with hands on attitude
• Good communication both in oral, writing and presentation in English
• Good interpersonal skill, able to deal with multi cultural and level of people
• Bachelor degree in electrical engineering. Master's degree, PhD is a plus.
• Self driven, team player and competitive attitude to be industry best in class.
Other Requirements
Education:No Limitations
Department:No Limitations
Experience:Over 5 years of experience
Language:
English：Listening/Intermediate Speaking/Intermediate Reading/Intermediate Writing/Intermediate
Management Responsibilities:To be determined
Business trip:No business trip required
Language:
English：Listening/Intermediate Speaking/Intermediate Reading/Intermediate Writing/Intermediate
Employee Benefits
Required by law:
Benefit system:
哺乳室
週休二日
家庭照顧假
勞保
健保
陪產假
產假
特別休假
育嬰留停
女性生理假
勞退提撥金
安胎假
產檢假
就業保險
防疫照顧假
員工體檢
職災保險
Benefit system:
三節獎金/禮品
特殊節日獎金禮品
醫務室
生活工作諮詢
不扣薪病假
新人假
結婚禮金
生育津貼
旅遊補助
住院慰問金
社團活動
員工停車位
伙食津貼
員工團體保險
可遠端/在家上班
其他值得一試的好工作
General Company | Specialty Personnel
資深工程師
硬體研發工程師｜電腦系統整合服務業｜竹東｜Salary negotiable (Regular monthly salary of NT$40,000 or above)
PADS
OrCAD
1、規劃設計三相BLDC/PMSM⾺達驅動器：
■ 功率級(MOSFET、Gate Driver、電流量測)
■ 控制級(MCU、感測器、保護迴路)
■ 電源級(Buck/Flyback輔助電源)。
2、設計保護機制：
OCP、OVP、UVLO、OTP、短路、反接、堵轉偵測、浪湧與突入電流抑制。
3、PCB電路與佈局：
電⼒與訊號區隔、散熱與堆疊規劃、DFM與可測試性(DFT)佈點。
■ 功率級(MOSFET、Gate Driver、電流量測)
■ 控制級(MCU、感測器、保護迴路)
■ 電源級(Buck/Flyback輔助電源)。
2、設計保護機制：
OCP、OVP、UVLO、OTP、短路、反接、堵轉偵測、浪湧與突入電流抑制。
3、PCB電路與佈局：
電⼒與訊號區隔、散熱與堆疊規劃、DFM與可測試性(DFT)佈點。
General Company | Specialty Personnel
研發處_製程開發工程師/高級工程師
機構工程師/機械工程師｜其他電子零組件相關業｜新北市｜Salary negotiable (Regular monthly salary of NT$40,000 or above)
繪製2D／3D模具設計圖
熟悉金屬加工製程
機構設計
1.機構3D設計、圖面2D繪製及公差標註
2.新產品開發打樣，檢治具設計/詢價/發包交期追蹤/驗收，DOE/
打樣報告建立
3.協助解決生產問題，提升良率及產能
4.新產品前期成型性模擬、製造可行性確認DFM(焊接/清洗/表面
處理/新工藝)
5.FMEA/PMP/SOP/SIP/BOM/規格書等文件制定，料號管理及申請
6.新工藝/技術開發
7.專利查詢/申請，執行科專紀錄
2.新產品開發打樣，檢治具設計/詢價/發包交期追蹤/驗收，DOE/
打樣報告建立
3.協助解決生產問題，提升良率及產能
4.新產品前期成型性模擬、製造可行性確認DFM(焊接/清洗/表面
處理/新工藝)
5.FMEA/PMP/SOP/SIP/BOM/規格書等文件制定，料號管理及申請
6.新工藝/技術開發
7.專利查詢/申請，執行科專紀錄
General Company | Specialty Personnel
研發處_工程師/高級工程師
機械工程師/機構工程師｜其他電子零組件相關業｜新北市｜Salary negotiable (Regular monthly salary of NT$40,000 or above)
CREO
AutoCad
治具
2D
3D繪圖
SolidWorks
1.依客戶的水冷散熱器產品設計提供可行性評估
2.依客戶的邊界條件進行產品設計與熱性能模擬(ODM案)
3.將客戶產品圖面(2D、3D)轉繪為公司內部半成品零件與成品組
立圖(OEM 案)
4.依照 APQP 流程需求製作開發階段需要的產品文件(如圖面、
BOM、樣品計劃書等等…)
5.依客戶產品需求進行包材設計
6. 開 發 階 段 產 品 之 規 格 問題 /潛 在風 險的統整與反饋
(Feasibility report & Design For Manufacturing)
2.依客戶的邊界條件進行產品設計與熱性能模擬(ODM案)
3.將客戶產品圖面(2D、3D)轉繪為公司內部半成品零件與成品組
立圖(OEM 案)
4.依照 APQP 流程需求製作開發階段需要的產品文件(如圖面、
BOM、樣品計劃書等等…)
5.依客戶產品需求進行包材設計
6. 開 發 階 段 產 品 之 規 格 問題 /潛 在風 險的統整與反饋
(Feasibility report & Design For Manufacturing)
Listed | Specialty Personnel
FPGA 工程師
數位IC設計工程師｜自動控制相關業｜台北市｜Salary negotiable (Regular monthly salary of NT$40,000 or above)
VHDL
Verilog
RTL Coding
FPGA
上巿櫃IC設計褔利佳
1. FPGA implementation.
2. Integration of related FPGA (high-speed) interfaces.
3. System integration and verification.
4. FPGA Design, C/C++.
5. System simulation.
2. Integration of related FPGA (high-speed) interfaces.
3. System integration and verification.
4. FPGA Design, C/C++.
5. System simulation.
Listed | Specialty Personnel
研發工程師
數位IC設計工程師｜IC設計相關業｜新竹市｜Salary negotiable (Regular monthly salary of NT$40,000 or above)
RTL Coding
工作穩定 公司發展好
影像演算法、數位RTL Coding
General Company | Specialty Personnel
研發工程師主管
其他工程研發主管｜光學器材製造業｜新竹市｜Salary negotiable (Regular monthly salary of NT$40,000 or above)
機構設計
軟韌體開發
1. AOI programming, system design and integration
2. Software writing (C, C++, Visual C++, MFC)
3. Requires knowledge related to imaging (image processing, image sensor, image quality, tuning, calibration, camera modules)
4. Software interface program modification.
5. Machine vision software design
2. Software writing (C, C++, Visual C++, MFC)
3. Requires knowledge related to imaging (image processing, image sensor, image quality, tuning, calibration, camera modules)
4. Software interface program modification.
5. Machine vision software design
General Company | Junior
研發主管
其他工程研發主管｜印刷電路板製造業(PCB)｜桃園市｜Salary negotiable (Regular monthly salary of NT$40,000 or above)
新技術開發
1. 新製程設立
2. 新產品導入
3. 重要VE與製程優化
4. Trouble shooting
5. 技術趨勢掌握與交流
6. 客訴處理
2. 新產品導入
3. 重要VE與製程優化
4. Trouble shooting
5. 技術趨勢掌握與交流
6. 客訴處理
General Company | Specialty Personnel
研發工程師/主管
數位IC設計工程師｜IC設計相關業｜苗栗縣市｜Salary negotiable (Regular monthly salary of NT$40,000 or above)
RTL
1. TOP/Block physical implementation (28nm以下), 有12nm/7nm 經驗尤佳
2. IR rail analysis(Voltus/Redhawk)
3. Layout verification (Calibre DRC/LVS)
4. Timing closure (Tempus/PrimeTime/Tweaker)
5. Tcl/Perl/Makefile programming (有此技能者優先考量)
2. IR rail analysis(Voltus/Redhawk)
3. Layout verification (Calibre DRC/LVS)
4. Timing closure (Tempus/PrimeTime/Tweaker)
5. Tcl/Perl/Makefile programming (有此技能者優先考量)
