Responsibilities
1. Establishment of new processes: Establish new equipment and new materials required for copper surface treatment and Metal Finishing processes, evaluate and introduce them (including establishment, implementation, inspection and improvement), and establish stable, capable and competitive processes.
2. New product introduction: Responsible for the development of technologies related to copper surface treatment and Metal Finishing processes required for NP and NPI-1 products, as well as the production output of related samples.
3. Lead important VE and process optimization: For the important VE of copper surface treatment and Metal Finishing process of NPI3 products, we can integrate and provide solutions and related Xn, and transfer them to engineering units and on-site units.
4. Trouble shooting: Assist in providing solutions to major quality anomalies related to copper surface treatment and Metal Finishing processes in each PCB factory.
5. Customer complaint handling: As
Ideal Candidate
Master's degree or above
Mainly science and engineering departments
PCB factory experience
More than 10 years of R&D or engineering management experience
English medium
Metal surface treatment, Metal finish, wet process related expertise