1. To engage business by value-selling with NTO and loading opportunities which needs more time to proliferate current & new customers , based on technology platforms, like BCD, eFlash, MEMS, GaN, SG discrete ( w/ BGBM turn-key). 2. To win more projects from Fabless & IDMs, especially for large geometry IC & SGT discrete opportunities. 3. To penetrate more PMIC Fabless customers in China & Japanese IDMs for new business model & new projects.