系統晶片研發主管 SoC Team Lead

硬体工程研发主管
电脑週边产品
新竹市
NTD 2,500,000~3,000,000 实际薪资由企业与人选面谈议定
上市柜 | 中阶 2022/06/15

系統晶片研發主管 SoC Team Lead

硬体工程研发主管
电脑週边产品
新竹市
NTD 2,500,000~3,000,000 实际薪资由企业与人选面谈议定

关键能力

SoC Design lead for emerging motor applications

职缺优势

電子EMS廠

工作职责

To manage all conception & scheming design of automotive product & evaluate the requirements for new product & determine the design plan
To organize research in new integrated technologies of automotive products with new EEA
To guide the development team & verify new technologies /architectures/product development
To guide the architectural design & communicate with clients or partners.
To manage the top level project issues & status-tracking & relevant mitigation plans
To coordinate with system design teams from silicon to system & SW design perspectives
To handle the related documents generation based on APQP process during development process.
To handle the SoC design specifications & test standards as required.
To handle the chip-level & system-level silicon validations & relevant certification.

理想人选

Well knowledge on SoC & ASIC level for automotive applications.
Well knowledge to guide SoC Product design specifications & architecture definitions.
Expert in defining verification requirements on block & chip level.
10+ year experiences in automotive chip product development.
Good leadership & management skills across multiple sites.

其他条件

学历:不拘
科系:不拘
年資:10年以上工作经验
语文:
英文:聽/精通 說/精通 讀/精通 寫/精通
管理责任:管理9-12人以下
出差外派:无需出差外派

公司福利

法定项目:勞保 健保 陪產假 產假 特別休假 育嬰留停 女性生理假 勞退提撥金 產檢假 就業保險 職災保險

案件编号:FA01004402

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