零件工程師/其他工程研發主管/硬體工程研發主管|被動電子元件製造業|新竹市|Thỏa thuận trực tiếp
packaging
NPI
To develop advance packaging platform with miniaturize, and high integration To development new power module product with high power density, and high efficiency NPD/QFD/DOE procedure Customers developing with sales