韌體設計產品經理

Engineering/R&D
Semiconductor/Electronic
台南市
Face-to-face negotiation
General Company | Mid-level 2024/02/20

韌體設計產品經理

Engineering/R&D
Semiconductor/Electronic
台南市
Face-to-face negotiation

Qualifications

熟馬達驅控技術C/C++/C#、HMI(UI/UX)、PLC、Microsoft officeFieldbus等通訊程式設計經驗Modbus, Modbus、DeviceNET、EtherCAT、CANopen韌體工程開發韌體程式設計MCU

Responsibilities

1、壓力控制閥軟韌體開發
2、步進馬達驅控技術
3、系統規劃整合、測試分析除錯
4、專案進度控管、結案報告

Ideal Candidate

1.MCU、C/C++/C#、HMI(UI/UX)、PLC、Microsoft office
2.Modbus, Modbus、DeviceNET、EtherCAT、CANopen 等現場總線通訊程式設計經驗

Other Requirements

Education:Undergraduate
Department:No Limitations
Experience:Over 5 years of experience
Language:
No Limitations
Management Responsibilities:Not need to bear any management responsibilities
Business trip:No business trip required

Employee Benefits

Required by law:勞保 健保 陪產假 產假 特別休假 育嬰留停 女性生理假 勞退提撥金 產檢假 就業保險 職災保險

Case Number:F000008681

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