封裝工程主管

Engineering/R&D
Semiconductor
台南市
Face-to-face negotiation
General Company | Junior 2022/06/08

封裝工程主管

Engineering/R&D
Semiconductor
台南市
Face-to-face negotiation

Qualifications

Assembly

Job Advantage

具完善的內部訓練與良好的職涯發展機會

Responsibilities

規劃、督導wire bond製程.異常處理與專案導入

Ideal Candidate

有wire bond經驗尤佳

Other Requirements

Education:No Limitations
Department:No Limitations
Experience:Over 5 years of experience
Language:
No Limitations
Management Responsibilities:To be determined
Business trip:No business trip required

Employee Benefits

Required by law:勞保 健保 陪產假 產假 特別休假 育嬰留停 女性生理假 勞退提撥金 產檢假 就業保險 職災保險

Case Number:F000004366

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