Engineering/R&D
Electronic components
龜山‧蘆竹‧大園
Face-to-face negotiation
Qualifications
WB經驗
Job Advantage
1. 上市公司
2.薪資福利佳
2.薪資福利佳
Responsibilities
1.封裝製程良率提升
2.制訂製造程序與產品標準
3.評估製程專案計劃，訂出最適化的製造流程
4.負責新產品製程的導入，並進行製程的檢測，使新產品能夠穩定生產且符合相關標準
2.制訂製造程序與產品標準
3.評估製程專案計劃，訂出最適化的製造流程
4.負責新產品製程的導入，並進行製程的檢測，使新產品能夠穩定生產且符合相關標準
Ideal Candidate
有WB製程或設備經驗
Other Requirements
Education:No Limitations
Department:No Limitations
Experience:Over 3 years of experience
Management Responsibilities:Not need to bear any management responsibilities
Business trip:No business trip required
Department:No Limitations
Experience:Over 3 years of experience
Language:
No Limitations
Business trip:No business trip required
Employee Benefits
Required by law:勞保 健保 陪產假 產假 特別休假 育嬰留停 女性生理假 勞退提撥金 產檢假 就業保險 職災保險
