Wire Bond Engineer

Engineering/R&D
Electronic components
龜山‧蘆竹‧大園
Face-to-face negotiation
General Company | Specialty Personnel 2022/05/13

Wire Bond Engineer

Engineering/R&D
Electronic components
龜山‧蘆竹‧大園
Face-to-face negotiation

Qualifications

WB經驗

Job Advantage

1. 上市公司
2.薪資福利佳

Responsibilities

1.封裝製程良率提升
2.制訂製造程序與產品標準
3.評估製程專案計劃,訂出最適化的製造流程
4.負責新產品製程的導入,並進行製程的檢測,使新產品能夠穩定生產且符合相關標準

Ideal Candidate

有WB製程或設備經驗

Other Requirements

Education:No Limitations
Department:No Limitations
Experience:Over 3 years of experience
Language:
No Limitations
Management Responsibilities:Not need to bear any management responsibilities
Business trip:No business trip required

Employee Benefits

Required by law:勞保 健保 陪產假 產假 特別休假 育嬰留停 女性生理假 勞退提撥金 產檢假 就業保險 職災保險

Case Number:F000004037

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